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Fujitsu Expands Grounding Spring Product Line for Mobile Designs

04 - 01 - 2017

Fujitsu Components America announced it has added two new, compact grounding spring connectors to its product offering to give designers more choices for the grounding requirements of printed circuit boards within the confines of mobile devices. Target applications include smartphones, tablet PCs and emerging wearable devices. 

With the two new additions, Fujitsu’s FCN-118X grounding spring series is now available in three different types, with free heights as low as 1.8mm and up to 2.5mm, and with working ranges of 0.85mm to 2.4mm. They have an operating temperature range of -40 to +85 degrees C.

Unique features of Fujitsu’s grounding springs are a patented side-wing construction, which prevents form deformation by outer force in handling, and a stop point that prevents further displacement If excessive contact force is applied.

In addition to providing frame grounding, some FCN-118x series grounding springs can also function as a power contact between printed circuit boards (4A max. for FCN-118X001-G/0).

Fujitsu’s grounding springs are RoHS-compliant and come packaged on reels for automatic pick-and-place mounting. Prices range from $0.035 to $0.04 each in 100K-piece quantities.