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13 - 11 - 2016

Powered by the very latest silicon technology, Laird’s 60 Series Wi-Fi + Bluetooth modules achieve the best possible connectivity and performance in any RF environment. With industry-leading software, broad OS support (Summit 60 only), and multiple form factors, Laird’s 60 Series offers flexibility to meet your needs. The 60 Series introduces 802.11ac, 2x2 MU-MIMO, Bluetooth 4.2 and Bluetooth 5 ready hardware on one lowpower module, delivering future-ready cutting edge technology for your product. Building on the security and robustness inherited from Laird’s expertise in its 40, 45, and 50 Series modules means ultra-high data rates, improved performance, and the most reliable wireless in crucial applications such as medical and industrial.

  • - New Wireless Capabilities: Advanced 802.11ac Wave 2, 2x2 MU-MIMO, Advanced Power Save, Optimized Internal BT/Wi-Fi Coexistence, Fast Roam
  • - New Form Factors: Extremely small 14mm x 13mm SiP module, and M.2 2230-E module
  • - Bluetooth 4.2: Enables Classic Bluetooth and Low Energy mode with latest security and throughput enhancements, all on Bluetooth 5 ready hardware
  • - Pre-calibrated for performance: Tuned in manufacturing


60 Series Product Family

Laird's 60 Series will be comprised of two classes of modules to give you flexibility in your wireless design:

  • - Sterling 60 - Professional grade connectivity with leading edge wireless technology
  • - Summit 60 - Most secure and robust wireless connectivity option for demanding Enterprise applications

Configuration Options:
60-SIPT (SIP Module)

  • - Featured on each 60 Series variant
  • - SDIO, USB, & PCIE options
  • - 14mm x 13mm x 1.7mm

60-2230C (USB of SDIO Module)

  • - Popular low-profile M.2 form factor (2230 E-key)
  • - Choose from USB or SDIO interface options
  • - 22mm x 30mm x 3mm